Ep. 019 - Inside the STEEL Lab: From Package to Transistor (Teardown Lab) | Afzal Ahmad, Andrew Wagner, Jordan Nanos

The Steel teardown lab at SemiAnalysis provides critical insights into semiconductor manufacturing and chip architecture by deconstructing consumer devices down to the transistor level. Through advanced techniques like focused ion beam milling, transmission electron microscopy, and chemical mechanical polishing, the team uncovers proprietary design choices and process node advancements. Analysis of the Huawei Kirin 9030 reveals how SMIC’s N+3 process node utilizes aggressive scaling and innovative library configurations to overcome the lack of EUV lithography. These teardowns expose significant architectural shifts, such as the transition in NPU core layouts, which demonstrate how designers maximize performance under strict export constraints. By bridging the gap between high-level floor plans and nanoscale cross-sections, the lab offers a transparent look at the competitive landscape of modern silicon development and advanced packaging.