What will computer chips look like in 2045?

Manufacturing the world’s most advanced semiconductors requires navigating a complex transition from simple scaling to radical architectural innovations like gate-all-around transistors and backside power. Intel’s leadership details the rigorous process of moving from research to high-volume manufacturing, emphasizing that predictable schedules and maturity metrics are as vital as technical breakthroughs. The industry faces a severe supply chain bottleneck, particularly regarding ASML’s EUV lithography machines, which limits the ability to scale compute capacity to meet explosive AI demand. As Intel shifts toward a foundry model, it must balance the high capital intensity of fab construction with the need for rapid, repeatable yield improvements. Ultimately, the future of compute depends on overcoming thermal dissipation limits and rethinking traditional fab infrastructure, as the industry moves toward a virtually vertically integrated model to secure sufficient silicon for the next decade of AI growth.