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26 May 2024

Japanese chipmaker Rapidus plans to build and package chips in the same $32B fab in Hokkaido, setting the company apart from TSMC, Intel, and Samsung (Anton Shilov/AnandTech)

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Japanese chipmaker Rapidus plans to build and package chips in the same $32B fab in Hokkaido, setting the company apart from TSMC, Intel, and Samsung (Anton Shilov/AnandTech)