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09 May 2024

SIA and BCG: by 2032, the US will have the capacity to manufacture 28% of chips below 10nm, while China is expected to make only 2% of the most advanced chips (Nikkei Asia)

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SIA and BCG: by 2032, the US will have the capacity to manufacture 28% of chips below 10nm, while China is expected to make only 2% of the most advanced chips (Nikkei Asia)