
The semiconductor industry faces structural supply constraints driven by the rapid expansion of AI compute requirements. HBM pricing remains moderate because it relies on existing DRAM wafers, yet this creates a "fixed pie" scenario that exacerbates commodity DRAM shortages. Advanced packaging has emerged as the new Moore's Law, with Intel’s E-MIDT technology positioning it as a critical player alongside TSMC. Power delivery and cooling represent the next major bottlenecks, as chip power draws are projected to double with each generation, necessitating innovations like 800-volt DC architectures and advanced liquid cooling. Meanwhile, the industry is shifting toward specialized AI accelerators and memory-centric designs, such as high-bandwidth flash, to bypass traditional memory bottlenecks and reduce reliance on established DRAM suppliers. These technical shifts are forcing a fundamental rethink of computer architecture at the rack scale.
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