AI HPC Future Fabrics Panel

The Future Fabrics panel discussion delved into the challenges and innovations surrounding the development of high-performance computing (HPC) and artificial intelligence (AI) systems on a large scale. Panelists highlighted the limitations of existing interconnect technologies, stressing the urgent need for solutions that offer high bandwidth, low latency, and energy efficiency. They also explored the growing overlap between HPC and AI, noting how AI systems increasingly rely on HPC techniques for better scalability and fault tolerance. The conversation introduced exciting new strategies, such as optimizing data movement on chips, utilizing optical interconnections, and even proposing a groundbreaking AI architecture inspired by neuromorphic principles that leverages superconducting circuits and optical communication. Additionally, the panelists discussed the current landscape of these technologies, ranging from those ready for immediate production to more visionary, long-term developments.